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深入AT&S:AI芯片关键底层制造的竞赛Inside AT&S and the race to make the critical layer beneath AI chips

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《亚洲管理》节目主持人陈韵红(Christine Tan)走进AT&S在马来西亚的工厂,CEO Michael Mertin解释了为什么IC载板——AI芯片下方的高科技基础层——随着AI需求增长和制造商争相扩产而变得愈发重要。

Managing Asia Managing Asia’s Christine Tan goes inside AT&S’s Malaysia plant, where CEO Michael Mertin explains why IC substrates — the high-tech base layers beneath AI chips — are becoming more important as AI demand grows and manufacturers race to add capacity.

2026年9月26日星期六 下午6:00 EDT 陈韵红 奥地利科技公司AT&S制造了一种鲜为人知但日益重要的AI芯片部件:IC载板。这些高科技基础层位于处理器和内存之下,帮助在先进芯片封装内部的组件之间传输电力和数据。

Sat, Sep 26 2026 6:00 PM EDT Christine Tan Austrian technology company AT&S makes a little-known but increasingly important part of AI chips: IC substrates. These high-tech base layers sit beneath processors and memory, helping carry power and data between components inside advanced chip packages.

《亚洲管理》深入马来西亚居林的AT&S制造基地,该公司正在那里扩大产能以应对不断增长的需求。

Managing Asia goes inside AT&S's manufacturing complex in Kulim, Malaysia, where the company is expanding capacity as demand grows.

CEO Michael Mertin探讨了技术竞赛、AT&S的扩产计划、载板市场的竞争,以及地缘政治如何重塑半导体供应链。请观看上方视频中的《亚洲管理》陈韵红专访。

CEO Michael Mertin discusses the technology race, AT&S's expansion plans, competition in the substrate market and how geopolitics is reshaping the semiconductor supply chain. Managing Asia with Christine Tan " in the video above.