新加坡——美国芯片制造商博通（Broadcom）与日本凸版控股（Toppan Holdings）周二提前数月在新加坡开设了该国首家先进芯片基板工厂，旨在加强这个东南亚国家在全球人工智能供应链中的作用。
SINGAPORE -- U.S. chipmaker Broadcom and Japan's Toppan Holdings opened Singapore's first advanced chip substrate plant months ahead of schedule on Tuesday, as the Southeast Asian nation seeks to strengthen its role in the global artificial intelligence supply chain.
该工厂将由博通与凸版合资成立的先进基板技术公司（AST）运营，并将生产用于各类高性能计算芯片的高端倒装芯片球栅阵列（FC-BGA）基板。
The facility will be operated by Advanced Substrate Technologies (AST), a joint venture between Broadcom and Toppan, and will produce high-end flip-chip ball grid array (FC-BGA) substrates used in a wide range of high-performance computing chips.
该工厂计划在今年年底前实现量产。博通表示，目前正与各方进行“积极讨论”，以确定进一步扩张的合适时机。
Mass production is planned before the end of the year, and Broadcom said it was already in "active discussions" with all parties involved to determine the appropriate timing for further expansion.
博通与凸版表示，凭借新的产能，他们旨在“缓解科技供应链中持续存在的瓶颈”，这一瓶颈目前正制约着人工智能芯片的制造和数据中心的建设。
With the new production capacity, the chipmaker and Toppan said they aimed to "ease a persistent bottleneck" in the tech supply chain that is constraining AI chipmaking and data center construction.
芯片基板是安装集成电路的基础组件。据《日经亚洲》此前报道，高端基板供应的短缺已成为行业的一大障碍，推高了整个供应链的价格。
Chip substrates are the building blocks on which integrated circuits are mounted. Limited supplies of high-end substrates in particular, have become a major hurdle for the industry, driving up prices across the supply chain, Nikkei Asia previously reported.
领先的芯片基板制造商包括日本的揖斐电（Ibiden）和新光电气（Shinko Electric）、台湾的欣兴电子（Unimicron）以及奥地利的奥特斯（AT&S）。主要用户包括英伟达、英特尔、谷歌、亚马逊和AMD等领先芯片制造商。
Leading chip substrate makers include Japan's Ibiden and Shinko Electric, Taiwan's Unimicron and Austria's AT&S. Major users include leading chipmakers Nvidia, Intel, Google, Amazon and AMD.
凸版的产能虽不及竞争对手，但其专长于为尖端人工智能处理器和网络交换机提供高端基板，这些产品对于实现人工智能计算中的高速数据传输至关重要。
Toppan has a smaller production capacity than its rivals, but specializes in high-end substrates for cutting-edge AI processors and networking switches, which are critical for enabling high-speed data transmission in AI computing.
新加坡新工厂生产的先进芯片基板将有助于缓解人工智能计算热潮导致的严重供应限制。该新加坡工厂刚刚进入验证和试生产阶段，是这家日本公司在海外的首家工厂。该设施还具备研发能力，以帮助满足客户对未来性能的需求。
Advanced chip substrates being made at the new Singapore plant will help ease severe supply constraints caused by the AI computing boom The Singapore facility, which just entered verification and test production, will be the Japanese company's first overseas plant The facility also houses R&D capabilities to help meet clients' future performance demands.
凸版印刷（Toppan）总裁兼首席运营官大矢智（Satoshi Oya）表示：“新加坡对我们而言始终是一个具有吸引力的目的地，也是通往全球半导体行业的门户，尤其是在这里拥有强大的创新生态系统、能力和资源。”
"Singapore continues to be an attractive destination and gateway to the global semiconductor industry for us, especially with a strong ecosystem of innovation, capabilities and resources," said Satoshi Oya, president and chief operating officer of Toppan.
博通（Broadcom）是全球市值第三高的芯片制造商，仅次于英伟达（Nvidia）和台积电（TSMC）。它是谷歌和Meta的关键人工智能芯片开发商和供应商，也是全球领先的网络交换芯片提供商。
Broadcom is the world's third-most-valuable chipmaker, behind only Nvidia and Taiwan Semiconductor Manufacturing Co. (TSMC). It is a key AI chip developer and supplier to Google and Meta, and is the world's leading provider of networking switch chips.
许多领先的人工智能芯片制造商已将先进的互连技术视为构建日益强大的人工智能计算系统的关键。
Many leading AI chipmakers have identified advanced interconnect technologies as key to building increasingly powerful AI computing systems.
博通半导体解决方案集团总裁查理·卡瓦斯（Charlie Kawwas）表示，在新加坡增加芯片基板产能“随着人工智能和网络芯片需求的持续攀升，为我们提供了重要的灵活性和差异化优势。”
Charlie Kawwas, president of Broadcom's semiconductor solutions group, said adding chip substrate capacity in Singapore "gives us meaningful flexibility and differentiation as demand for AI and networking silicon continues to climb."
卡瓦斯说：“该设施提前三个月投入运营，在行业受限于基板短缺的情况下提供了至关重要的缓解，从而增强了我们的供应链韧性。”这位高管补充道：“目前基板供应严重短缺，这一举措将使我们在技术和供应方面都具备差异化优势。”博通此前已选择新加坡作为加强其供应链韧性的关键基地。该公司最近宣布计划与其中一家芯片封装供应商——台湾力成科技（Powertech Technology）在新加坡建立合资企业。
"This facility, brought online three months early, strengthens our supply chain resilience by delivering vital relief while the industry is constrained by substrate shortages," Kawwas said. The executive added that there was "a severe shortage in substrate supply today, and this initiative will differentiate us both in terms of technology and supply." Broadcom had already chosen Singapore as a key base to strengthen its supply chain resilience. The company recently announced plans to establish a joint venture in the city-state with one of its chip packaging suppliers, Taiwan's Powertech Technology.
在人工智能基础设施投资热潮的背景下，新加坡一直致力于吸引更多先进芯片投资，并力求将自身打造为全球科技供应链中的关键枢纽。业内高管表示，该国政局稳定、政策可预测且受自然灾害影响相对较小，使其成为极具吸引力的投资目的地。根据政府最新公布的数据，2025年新加坡制造业吸引的外国直接投资额已升至79.6亿新加坡元（约合62.3亿美元）。
Singapore has been seeking to attract more advanced chip investment and establish itself as a critical hub in the global tech supply chain amid the AI infrastructure investment boom. Industry executives say the city-state's political stability, predictable policies and relatively low exposure to natural disasters make it an attractive investment destination. Foreign direct investment in Singapore's manufacturing sector rose to 7.96 billion Singapore dollars ($6.23 billion) in 2025, according to the latest available government data.
新加坡经济发展局主席方章文表示：“AST的工厂将提升新加坡在先进基板领域的能力，这是实现先进封装的关键推动力，并将巩固我们在全球半导体价值链中的地位。”
"AST's facility will boost Singapore's capabilities in advanced substrates, which is a critical enabler for advanced packaging, and strengthen our position in the global semiconductor value chain," said Png Cheong Boon, chairman of the Singapore Economic Development Board.
市场研究公司Yole的数据显示，受人工智能和高性能计算强劲需求的推动，未来五年全球先进芯片基板市场预计将以每年12%的速度增长。
The global market for advanced chip substrates is projected to grow 12% annually over the next five years, driven by strong demand for AI and high-performance computing, according to market research firm Yole.
博通公司（Broadcom）的Kawwas表示，这些先进芯片基板将支持该公司最先进的Tomahawk 6交换芯片及其最新的人工智能加速器。他补充称，预计到2026年，仅博通的人工智能半导体收入就将达到560亿美元，并有望在2028年激增至2300亿美元，这将需要大幅提升先进芯片基板的产能。
Broadcom's Kawwas said the advanced chip substrates will support the company's most advanced Tomahawk 6 switch chip and its latest AI accelerators. He added that Broadcom's AI semiconductor revenue alone is expected to reach $56 billion in 2026 and is estimated to surge to $230 billion by 2028, requiring a significant increase in advanced chip substrate capacity.
就在前一天，与台积电（TSMC）有关联的芯片制造商世界先进（Vanguard International Semiconductor）在新加坡开设了其最先进的芯片制造工厂。该工厂是与恩智浦（NXP）的合资项目，旨在满足人工智能基础设施日益增长的需求。该公司表示，目前已在规划建设第二座工厂。
A day earlier, TSMC-linked chipmaker Vanguard International Semiconductor opened its most advanced chipmaking plant in Singapore, a joint venture with NXP, to feed growing demand for AI infrastructure. The company said it was already planning a second plant.