据知情人士透露，一个与博通公司（Broadcom Inc.）合作的华尔街银行银团正在筹集600亿美元的新增债务融资，以支持 Anthropic PBC 等公司获取AI芯片并建设相关基础设施。
Broadcom Syndicate Assembles $60 Billion Debt Package to Fund AI Chips A Wall Street banking syndicate working with Broadcom Inc. is gathering $60 billion in fresh debt financing to support AI chip access and infrastructure for Anthropic PBC and other companies, according to people familiar with the matter.
作为该交易的一部分，参与的贷款机构正准备为一笔420亿美元的A类高级有担保债务分档签发银团贷款函。该融资方案尚未正式公布。
As part of the transaction, participating lenders are preparing to issue syndication letters for a $42 billion Class A senior-secured debt tranche. The financing package has not yet been officially announced.