在芯片制造商格芯（GlobalFoundries Inc.）宣布与台湾积体电路制造股份有限公司（TSMC）达成一项为期五年、价值20亿美元的协议，为其提供美国本土产能后，其股价一度上涨高达7%。
Inc. shares gained as much as 7% after the chip manufacturer announced a five-year, $2 billion deal to provide US production capacity to Taiwan Semiconductor Manufacturing Co.
根据周四宣布的协议，格芯将协助供应被称为硅中介层（silicon interposers）的组件。这家美国公司将依托其位于纽约州马尔他的工厂进行生产，并表示有权“随着客户需求的增长”扩大产能。中介层是位于芯片和封装之间的一层小型硅片，其内部布满了使芯片正常工作所需的电子信号和电力传输线路。随着半导体尺寸不断变大以及各大公司将多个芯片组合在同一个封装中，这些组件变得愈发重要。
Under the agreement, announced Thursday, GlobalFoundries will help supply components known as silicon interposers. The US company will rely on manufacturing at its facility in Malta, New York, and said it has the option to expand capacity “as customer demand grows.”An interposer is a small layer of silicon that sits between a chip and its packaging. It’s home to the wires that carry electronic signals and power needed to make that chip functional. The components are increasingly important as semiconductors become larger and companies combine multiple chips into the same package.
在台积电致力于扩大其美国业务布局之际，该协议为台积电提供了一个额外的美国本土生产来源。台积电是占据主导地位的芯片代工厂——即为外部客户生产半导体的企业——其客户包括英伟达、苹果和超威半导体（AMD）等。
The deal provides TSMC with an additional US-based source of production at a time when the Taiwanese company is working to expand its American footprint. TSMC is the dominant chip foundry — a business that produces semiconductors for outside customers — and serves clients such as Nvidia Corp., Apple Inc. and Advanced Micro Devices Inc.
格芯股价最高触及51.45美元，创下三周以来最大盘中涨幅。截至周三收盘，该股今年以来已累计上涨38%。
Shares of GlobalFoundries rose as high as $51.45, marking their biggest intraday gain in three weeks. The stock had been up 38% this year through Wednesday’s close.
格芯的代工业务通常专注于技术相对不那么复杂的芯片，即其所谓的“基础半导体”。而市场对硅中介层等封装技术的日益关注，使该公司得以在更先进的AI组件中发挥作用。
GlobalFoundries’ foundry business is generally focused on less sophisticated chips, what it calls “essential semiconductors.”Greater interest in technology like silicon interposers for packaging is giving the company a role to play in more advanced AI components.
格芯高级副总裁埃德·卡斯特（Ed Kaste）在声明中表示：“先进封装对于实现下一代AI系统所需的性能、功耗效率和规模正变得日益关键。”
“Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems,” Ed Kaste, a GlobalFoundries senior vice president, said in the statement.
该公司预计将于2028年上半年开始逐步提高台积电组件的量产规模。
The company expects to begin ramping up volume production of the TSMC components in the first half of 2028.