日本半导体材料巨头住友贝克莱特计划在中国和新加坡扩大先进芯片封装材料的产能，标志着其在中国的业务在不到四个月内第二次宣布扩产，因为人工智能推动了对更先进半导体的需求。
Japanese semiconductor materials giant Sumitomo Bakelite plans to expand production of advanced chip packaging materials in China and Singapore, marking the second such announcement for its Chinese operations in less than four months as artificial intelligence drives demand for more sophisticated semiconductors.
这家总部位于东京的公司周五表示，将在其位于苏州东部的设施增加模塑底部填充（MUF）材料和压缩成型颗粒的生产线...
The Tokyo-based company said on Friday that it would add production lines for mould underfill (MUF) materials and compression-moulding granules at its facilities in Suzhou, eastern...