2026年10月12日，英伟达与思科联合发布了专为人工智能数据中心设计的超高密度小型可插拔光模块（USFP）。
该模块可支持每通道400吉比特/秒的电信号传输，使整个网络系统的总传输容量最高可达12.8太比特/秒。
NVIDIA and Cisco Unveil USFP Pluggable Optical Form Factor for AI Data Centers On October 12, 2026, NVIDIA and Cisco announced the Ultra-Dense Small Form Factor Pluggable (USFP), an optical module designed to support 400Gb/s-per-lane electrical signals and deliver total capacity up to 12.8Tb/s for AI networks.
与每通道200吉比特/秒的传统光模块相比，USFP在相同的OSFP尺寸规格下实现了四倍的带宽密度以及1.3倍的能效提升。
The specification offers four times the bandwidth density and 1.3 times the power efficiency of 200Gb/s-per-lane optics within an OSFP footprint.
目前，英伟达与思科正联合泰科电子和安费诺共同研发相关硬件组件，并致力于将该技术打造为一个开放的多厂商行业标准。
NVIDIA and Cisco are partnering with TE Connectivity and Amphenol to develop hardware components and plan to establish an open multi-source industry standard.