AMD 正在扩展其机架级 AI 产品线，推出一种可运行 AI 代理的设计，提供仅 CPU 配置或集成 CPU/GPU 部署，以及液冷或风冷版本。该设计于美国加州圣何塞举行的开放计算项目（OCP）峰会 2026 上揭晓。该芯片制造商的新机架参考设计命名为 Helion，而其现有系统则称为 Helios，这难免让人感到有些混淆。Helion 提供了一套符合 OCP 标准的蓝图，用于构建围绕 AMD CPU 和加速器的代理型 AI 基础设施。
AMD is expanding its rack-scale AI lineup with a design to run AI agents, offering CPU-only configurations or integrated CPU/GPU deployments, and liquid-cooled or air-cooled versions. Revealed at the Open Compute Project (OCP) Summit 2026 in San Jose, California, the chipmaker's new rack reference design is named Helion, while its existing system carries the moniker Helios, which we can't help feeling is inviting confusion a little. Helion offers an OCP-compliant blueprint for agentic AI infrastructure built around AMD's CPUs and accelerators.
AMD 于今年早些时候推出了 Helios，用于前沿规模的 AI 训练和大规模推理。而 Helion 的企业级配置则在单个机架内结合了代理执行和推理。客户可选择仅 CPU 的超大规模配置，或包含 CPU 和 GPU 刀片混合的企业级配置。根据不同配置，AMD 声称最高可提供 32,768 个其“Zen 6” CPU 内核，通过搭载其 Venice Epyc 处理器 256 核心版本的计算节点实现，最高可提供 16 个 Instinct MI350P GPU 加速器，以及最高 102 Tbps 的网络带宽。
AMD launched Helios earlier this year for frontier-scale AI training and large-scale inference. Helion's enterprise configuration instead combines agent execution and inference within a single rack. Customers can opt for a CPU-only hyperscale configuration or an enterprise configuration with a mix of CPU and GPU blades. Depending on configuration, AMD advertises up to 32,768 of AMD's "Zen 6" CPU cores, delivered via compute nodes fitted with 256-core versions of its Venice Epyc processor, up to 16 of its Instinct MI350P GPU accelerators, and up to 102 Tbps of networking bandwidth.
仅 CPU 的超大规模版本提供专用容量用于代理执行，并连接至独立的模型推理基础设施；而企业级配置则在单个机架内结合代理执行、GPU 推理及支撑工作负载。两种配置均提供密集型、均衡型或高性能 CPU 刀片。对于密集型部署，使用功耗为 400 W 的 EPYC 9006 芯片；而性能型刀片则采用仅 96 核但主频达 5 GHz 的该芯片版本。
The CPU-only hyperscale version offers dedicated capacity for agent execution and connections to separate model inference infrastructure, while the enterprise configuration combines agent execution, GPU inference, and supporting workloads in one rack. Both configurations offer dense, balanced, or high-performance CPU blades. For dense deployments, EPYC 9006 chips rated at 400 W are used, while performance blades sport a version of the chip with just 96 cores but clocked at 5 GHz.
均衡型刀片使用功耗为 600 W 的 256 核心处理器。此外，还有 GPU 推理刀片，每个 5U 服务器集成八颗 Instinct MI350P GPU，以及通用刀片，用于数据库和存储服务器或技术计算工作负载。
Balanced blades use 256-core processors rated at 600 W. There are also GPU inference blades, with eight Instinct MI350P GPUs in a 5U server, plus general-purpose blades, intended for database and storage servers or technical compute workloads.
AMD 计算与企业 AI 高级副总裁丹·麦克纳马拉表示，代理型 AI 不是单一工作负载，而是覆盖企业应用和复杂工作流，每种工作负载都有不同的计算需求。“要实现这一点需要优化的计算和能够适应不同工作负载的基础设施。通过 AMD Helion，我们将 Epyc 性能、开放软件和灵活的机架设计结合在一起，使合作伙伴能够围绕客户需求构建系统，并高效利用可用电力，” 他补充道。
AMD SVP for Compute and Enterprise AI Dan McNamara said agentic AI is not a single workload, spanning enterprise applications and complex workflows, each with different compute requirements. "To do that takes optimized compute and infrastructure that can adapt to different workloads. With AMD Helion, we are bringing Epyc performance, open software and flexible rack designs together so our partners can build systems around customer needs and make efficient use of available power," he added.
AMD 表示计划将 Helion 规范提交给 OCP，以便社区进行进一步开发和采用。合作伙伴构建的 Helion 配置预计将于 2026 年 11 月推出。在其公告中，AMD 引用了思科、戴尔、惠普、富士康、联想、超微以及其他公司作为新套件的支持方。®
AMD says it plans to contribute the Helion specifications to OCP, making them available to the community for further development and adoption. Partner-built Helion configurations are scheduled for November 2026. In its announcement, AMD cites Cisco, Dell, HPE, Foxconn, Lenovo, Supermicro, and others as on board with the new kit. ®