华为技术公司自2023年重返智能手机市场并推出新一代高端手机以来，已出货超过1亿台搭载其麒麟处理器的设备。公司表示，其下一代麒麟2027芯片的测试也在按预期进展。
Huawei Technologies has shipped more than 100 million devices powered by its Kirin processors since 2023, when it returned to the smartphone market with a new generation of premium handsets. The company says testing of its next-generation Kirin 2027 chip is also progressing in line with expectations.
公司在周二发布旗舰麒麟9050系列的新细节时披露了这一数据，该系列是首款采用其自研LogicFolding架构的量产芯片，该架构是在其提出的Tau缩放定律框架下开发的。
The company disclosed the figure on Tuesday as it unveiled new details about its flagship Kirin 9050 series, the first mass-produced chip using its proprietary LogicFolding architecture, developed under a framework it calls the Tau Scaling Law.
华为表示，新芯片设计集成了超过5000万个混合键合，并使晶体管密度提高了53.5%。公司称：“麒麟9050系列在中国国内电子产业链的支持下，已成功实现量产。”
Huawei said the new chip design integrates more than 50 million hybrid bonds and improves transistor density by 53.5 per cent. “The Kirin 9050 series has successfully achieved mass production with the support of China’s domestic electronics supply chain,” the company said.
第一财经周二报道称，华为已开始测试其下一代麒麟2027处理器，初步结果符合公司目标。报道引用了华为半导体业务负责无线设备芯片的主管许松宇的说法。
Chinese media outlet Yicai reported on Tuesday that Huawei had also begun testing its next-generation Kirin 2027 processor, with preliminary results meeting the company’s targets. The report cited Xu Songyu, a director responsible for wireless device chips at Huawei’s semiconductor business.
许松宇在周二于上海举行的新闻发布会上表示，尽管早期对LogicFolding技术能否在保持产良率的前提下实现规模化生产存在不确定性，但该技术的进展已超出华为的预期，据第一财经报道。华为未立即回应《南华早报》的置评请求。
Speaking at a press briefing on Tuesday in Shanghai, Xu said progress on LogicFolding had surpassed Huawei’s expectations despite early uncertainty over whether the technology could be manufactured at scale while maintaining production yields, according to Yicai. The company did not immediately respond to the South China Morning Post’s request for comment.
LogicFolding是华为Tau缩放定律下的一项技术，该定律于5月宣布。该方法提出通过改善芯片内部及跨计算系统之间的数据传输速度，实现半导体开发的重大转变。
LogicFolding is a technique under Huawei’s Tau Scaling Law, which was announced in May. The approach proposes a major shift in semiconductor development by improving how quickly data moves between parts of a chip and across a computing system.
该策略旨在通过优化半导体设计提升算力，而无需依赖最先进的芯片制造设备，尤其是被美国主导的出口管制封锁的全球领先光刻工具。
The strategy aims to extract more computing power through optimised semiconductor designs without relying on the most advanced chipmaking equipment, particularly the world’s cutting-edge lithography tools blocked by US-led export controls.
华为还在扩展其在用于驱动人工智能系统的半导体领域的业务。由于美国的限制措施使得中国企业难以获得最先进的美国处理器，华为的Ascend AI芯片在中国市场逐渐获得了更多市场份额。
Huawei is also expanding its business in semiconductors used to power artificial intelligence systems, with its Ascend AI chips gaining ground in the Chinese market as Washington’s restrictions limit access to the most advanced American processors.
根据路透社援引的研究机构IDC的数据，华为在2026年上半年共出货了57.2万台AI加速器，这一数字较去年同期（约30万台）大幅增长，该公司在中国数据中心AI芯片市场中的份额达到了28%。AI加速器是一种专门用于训练和运行人工智能模型的处理器。
The company shipped 572,000 AI accelerators in the first half of 2026, up from more than 300,000 a year earlier, capturing a 28 per cent share of China’s data centre AI chip market, according to research firm IDC data reported by Reuters. AI accelerators are specialised processors used to train and run AI models.
路透社还报道称，同期英伟达在中国市场共出货了67.8万台AI加速器，市场份额为34%，较去年同期（44%）有所下降。IDC对此数据未发表评论。
Nvidia shipped 678,000 AI accelerators in China over the same period, giving it 34 per cent of the market, down from 44 per cent a year ago, Reuters reported, citing IDC, which declined to comment on the data.
2020年，华为的芯片业务曾遭遇挫折：美国更严格的制裁措施禁止该公司使用台湾积体电路制造公司的代工服务。2023年，华为推出了自主研发的麒麟9000系列处理器，并将其应用于Mate 60 Pro智能手机中。
Huawei’s chip ambitions suffered a setback in 2020 when tighter US sanctions barred the company from using the foundry services of Taiwan Semiconductor Manufacturing Company. The company returned with its home-grown Kirin 9000s processor in 2023, which powered its Mate 60 Pro smartphone.