芯片制造商Rapidus宣布与印度HCL Technologies（HCLTech）建立合作伙伴关系，以加速下一代半导体的开发。
Chipmaker Rapidus has announced a partnership with India’s HCL Technologies, or HCLTech, to accelerate the development of next-generation semiconductors.
根据周一发布的公告，双方已在印度共同设立两个开发中心，并已于当天全面投入运营。
According to the announcement Monday, the two companies have jointly established two development centers in India, which began fully operating the same day.
通过新设施，这家印度主要信息技术公司计划为总部位于东京的Rapidus提供一系列技术，包括光掩膜设计以及芯片设计所需的工艺设计套件（PDK）开发。
Through the new facilities, the major Indian information technology firm plans to provide Tokyo-based Rapidus with a range of technologies, including for the designing of photomasks and the development of process design kits, or PDKs, necessary for chip designing.
HCLTech还将培养芯片设计专家，以帮助Rapidus满足未来的人力资源需求。
HCLTech will also foster chip designing experts to help Rapidus meet its future need for human resources.
Rapidus计划在2026财年发布PDK，HCLTech将参与开发。
Rapidus plans to release PDKs in fiscal 2026, with HCLTech participating in the development.
同样在周一，IBM日本公司宣布已在北海道千岁市设立业务办公室，以支持包括Rapidus在内的半导体相关客户。
Also on Monday, IBM Japan announced that it has opened a business office in Chitose, Hokkaido, to support its semiconductor-related clients including Rapidus.
利用IBM的技术，Rapidus旨在2027财年在其千岁工厂开始大规模生产线宽为2纳米的半导体。该市还聚集了许多其他半导体相关企业的据点。
Using technology from IBM, Rapidus aims to start mass production of semiconductors with a circuit line width of 2 nanometers at its plant in Chitose in fiscal 2027. The city also hosts footholds of many other semiconductor-related companies.