据香港交易所文件显示，在本月最后一个交易日，芯片供应商苏州登临科技股份有限公司和合芯电子股份有限公司引领了一波上市申请潮，为开始降温的融资活动注入新活力。此前港股IPO曾经历一段火爆行情。
Chip suppliers Suzhou Denglin Technology Co. and Hosin Electronics Co. led a rush of listing launches in Hong Kong on the last trading day of the month, giving fresh life to fundraising activity that had started to flag after a blistering run.
六家公司计划合计筹集60亿港元（约7.65亿美元）。根据彭博社测算，规模最大的是登临科技的首次公开募股（IPO），拟筹资最多17.6亿港元；合芯电子拟筹资最多12.2亿港元。
Six companies aim to raise a combined HK$6 billion ($765 million), filings to the Hong Kong stock exchange show. The biggest is Denglin’s, which is seeking up to HK$1.76 billion in an initial public offering, while Hosin is aiming for as much as HK$1.22 billion, according to Bloomberg calculations.
今年以来香港IPO累计筹资516亿美元，逼近2010年578亿美元的纪录，主要得益于中国科技公司推动。但随着投资者对人工智能板块情绪动摇，加上监管对交易的审查趋严，上市节奏已开始放缓。彭博汇编的数据显示，10月仅有3宗IPO完成，远低于1月至9月月均约13宗的水平。
Hong Kong IPOs have raised $51.6 billion this year, approaching the 2010 record of $57.8 billion, largely driven by Chinese technology companies. But the flow had started to slow as investor sentiment wobbled over the artificial intelligence trade, as well as intensified regulatory scrutiny on deals. Only three IPOs were completed in October, versus an average of about 13 a month from January through September, data compiled by Bloomberg show.
周五启动融资的其他公司中，赣州和美药业股份有限公司和江苏芯德半导体科技股份有限公司（一家芯片封测企业）拟筹资均超10亿港元。睿易储能科技股份有限公司和四川纽脉斯中药股份有限公司也启动了融资交易。
Among the others Friday, Ganzhou Hemay Pharmaceutical Co. and chip packaging and testing company Jiangsu Xinde Semiconductor Technology Co. are both seeking in excess of HK$1 billion. RelyEZ Energy Storage Technology Co. and Sichuan Neautus Traditional Chinese Medicine Co. also launched fundraising deals.