中国内存芯片巨头长鑫存储科技股份有限公司（CXMT）计划投资349亿元人民币（约合52亿美元）用于扩张，其中大部分资金将用于采购国内芯片制造设备。
Chinese memory chip giant ChangXin Memory Technologies (CXMT) plans to invest 34.9 billion yuan (US$5.2 billion) in expansion, with a large portion of the capital going to domestic suppliers of chipmaking equipment, according to a source.
根据该公司周一提交的股票文件，这家在上海证券交易所科创板上市的公司将花费241亿元人民币用于新技术研发项目，另外108亿元人民币将用于晶圆测试基地的第二阶段建设。
The firm, listed on the Shanghai Stock Exchange’s Star Market, would spend 24.1 billion yuan on a new technology research and development project and another 10.8 billion yuan on the second phase of a wafer testing base, according to a Monday stock filing.
该支出计划凸显了这家动态随机存取存储器（DRAM）生产商在推动产品升级过程中对资本的高度依赖性。文件显示，研发项目预算的近93%（约224亿元人民币）将用于设备采购。
The spending plan underscores the capital-intensive nature of the dynamic random-access memory (DRAM) producer’s push into more advanced products. Nearly 22.4 billion yuan, or about 93 per cent of the R&D project’s budget, would go towards equipment purchases, the filing said.
据一位不愿公开姓名的公司供应链内部人士透露，长鑫存储最新采购的设备中，有很大一部分将来自中国本土供应商。
A large portion of CXMT’s latest equipment spending is expected to go to Chinese suppliers, according to a person close to the company’s supply chain who declined to be identified because the information is not public.
这位人士对《南华早报》表示：“公司的本地化采购目标非常激进”，但并未具体说明国产设备的采购比例。
“The localisation target is very aggressive,” the person told the South China Morning Post, without giving a specific target for the share of domestically made equipment.
作为目前中国大陆股市上市值最高的公司，长鑫存储计划使用其7月份首次公开募股（IPO）获得的额外收益中的180亿元人民币来资助这些新项目。该计划仍需等待股东批准。
Now the most valuable company on mainland China’s stock market, CXMT plans to use 18 billion yuan of excess proceeds from its July initial public offering to fund the new projects. The plan is still pending shareholder approval.
该公司拒绝就本地化采购的具体目标以及计划中的设备采购费用中有多少将用于国内供应商的问题发表评论。
The company declined to comment on the localisation target or how much of the planned equipment spending would go to domestic suppliers.
中国国内的芯片制造厂正在设定雄心勃勃的本地化采购目标。本月早些时候，在江苏省无锡市举行的一场行业会议上，Britech半导体设备（上海）公司的董事长陈杰表示，当地一家新芯片制造厂的目标是实现设备采购的80%本地化。
Chinese fabs are setting ambitious targets for sourcing equipment locally. One new fab in the city was aiming for 80 per cent localisation of its equipment, said Jie Chen, chairman of Britech Semiconductor Equipment (Shanghai), at an industry conference earlier this month in Wuxi, in the eastern province of Jiangsu.
在先进存储芯片生产领域，实现这些目标可能更为困难，因为一些来自外国供应商的关键制造工具仍然难以替代。
Such targets can be harder to achieve in advanced memory production, where some critical manufacturing tools from foreign suppliers remain difficult to replace.
摩根士丹利在8月的一份报告中表示，随着长鑫存储（CXMT）扩大产能并向更先进的DRAM技术迈进，其“设备密集度”可能会上升，因为这些技术需要日益复杂的刻蚀、沉积、清洗和检测工艺。
Morgan Stanley said in an August report that CXMT’s “equipment intensity” was likely to rise as it expanded capacity and moved towards more advanced DRAM technologies, which required increasingly complex etching, deposition, cleaning and inspection processes.
该公司的投资计划也表明，其正致力于将更多的生产流程转向内部。公司表示，随着晶圆产量和产品种类的增加，扩大自身的测试能力将减少对外部封装和测试供应商的依赖。
The company’s investment plan also points to its effort to bring more of the production process in-house. The company said expanding its own testing capacity would reduce its reliance on external packaging and testing suppliers as wafer output and product variety increased.
长鑫存储正在迅速扩大生产规模，力求缩小与全球存储芯片巨头三星电子、SK海力士和美光科技之间的差距。
CXMT has been rapidly scaling up production as it seeks to narrow the gap with global memory leaders Samsung Electronics, SK Hynix and Micron Technology.
长鑫存储成立于2016年，现已成为中国最大的DRAM生产商。摩根士丹利预计，长鑫存储的月度DRAM产能将从2025年底的18万片晶圆增加到2028年的50万片。
Founded in 2016, CXMT has become China’s biggest DRAM producer. Morgan Stanley estimated that CXMT’s monthly DRAM capacity would hit 500,000 wafers in 2028, up from 180,000 at the end of 2025.
在政府推动减少对海外半导体供应商依赖的背景下，该公司的产品组合已从DDR4和LPDDR4X扩展到更新的DDR5和LPDDR5产品。
Amid Beijing’s push to reduce reliance on overseas semiconductor suppliers, the company’s product portfolio has expanded from DDR4 and LPDDR4X into the newer DDR5 and LPDDR5 products.
本月初，长鑫存储还宣布了LPDDR6芯片的量产，该芯片已在小米的18 Fold旗舰智能手机上首次亮相。
Earlier this month, CXMT also announced mass production of LPDDR6 chips, which debuted in Xiaomi’s 18 Fold flagship smartphone.
本月，长鑫存储表示其被称为G5的第五代DRAM制造平台已进入量产阶段，这标志着其在缩小与全球领先企业差距方面又迈进了一步。
This month, CXMT said its fifth-generation DRAM manufacturing platform, dubbed G5, had entered mass production, marking another step in narrowing the gap with global leaders. By Howard Liu