在关于印度芯片制造雄心的两部分系列报道的第二部分中,亚洲新闻台(CNA)关注本土初创企业如何为摄像头、汽车及其他设备开发专用AI芯片。
In the second of a two-part series on India’s chipmaking ambitions, CNA looks at how homegrown startups are developing specialised AI chips for cameras, cars and other devices.
新德里:普拉蒂克·帕玛尔在本月举行的Semicon India 2026大会上,指着其初创公司Atomo设计的一块电路板。该电路板让摄像头和机器能够发现火灾、统计人数或识别工厂缺陷,而无需持续将数据发送至云端。
NEW DELHI: Pratik Parmar pointed to a circuit board designed by his startup Atomo at the Semicon India 2026 conference this month. It allows cameras and machines to spot fires, track the number of people or identify factory defects without constantly sending data to the cloud.
帕玛尔表示:“你不需要互联网或云端。发生在你场所内的事情,留在你场所内。”
“You don't require the internet or cloud. What happens in your premises stays in your premises,” said Parmar.
这种被称为边缘人工智能(AI)芯片的产品,可在摄像头、汽车和其他电子设备中本地运行AI,并可针对特定设备和任务进行定制。
Known as edge artificial intelligence (AI) chips, they power AI locally in cameras, cars and other electronics and can be tailored to specific devices and tasks.
Atomo的电路板目前依赖美国设计的Amlogic芯片,因为三年前选择芯片时,合适的印度替代方案尚不成熟。
Atomo’s circuit board currently relies on a US-designed Amlogic chip because suitable Indian alternatives were not mature enough when it chose one three years ago.
但情况正在改变。围绕这些专用AI芯片的印度本土产业已初具雏形,本土企业正将其首批产品推向客户测试和商业化阶段。
But that is changing. A nascent Indian industry around these specialised AI chips has emerged, with homegrown firms now moving their first products into customer testing and commercialisation.
根据印度电子与信息技术部的数据,在一项政府芯片设计计划下,105家初创企业和小型企业获得了先进设计工具的使用权,并已完成约35项可投产的芯片设计。
Under a government chip-design programme, 105 startups and small businesses have gained access to advanced design tools, and have produced about 35 chip designs ready for manufacturing, according to India’s electronics ministry.
尽管印度在设计AI数据中心芯片的竞赛中起步较晚,但业内高管告诉CNA,该国仍有竞争空间。
While India is late to the race to design chips for AI data centres, industry executives told CNA that the country still has room to compete.
印度半导体协会(SEMI India)和印度电子与半导体协会主席阿肖克·钱达克表示:“印度不必制造世界上最快的AI处理器。将智能植入摄像头、车辆和日常电子产品,可能是一个更切实可行的切入点。”
“India does not have to build the world's fastest AI processor. Putting intelligence into cameras, vehicles and everyday electronics could be a more realistic opening,” said Ashok Chandak, president of industry bodies SEMI India and the India Electronics and Semiconductor Association.
“但软件、规模和客户采纳才是真正的考验。” 印度瞄准 AI 芯片机遇 印度半导体市场预计将从 2026 年的 640 亿美元增至 2035 年的 2000 亿美元,增幅达三倍,其中消费电子、汽车和工业应用占需求的 61%。
“But software, scale and customer adoption remain the real tests.”INDIA EYES AN AI CHIP OPENING India’s semiconductor market is expected to triple from US$64 billion in 2026 to US$200 billion by 2035, with consumer electronics, automobiles and industrial applications accounting for 61 per cent of demand.
专家表示,AI 系统越来越需要在本地处理数据以实现更快响应,而非依赖遥远的数据中心。
AI systems increasingly need to process data locally for faster responses rather than rely on distant data centres, experts said.
例如,汽车需要立即对障碍物做出反应,而工厂摄像头可能需要实时检测缺陷。
A car, for instance, needs to react immediately to an obstacle, while a factory camera may need to spot defects in real time.
为芯片设计师开发处理器技术的 InCore Semiconductors 首席执行官 G S Madhusudan 表示,这种本地智能正扩展至从汽车、摄像头到电视和工业设备等各类产品。
G S Madhusudan, CEO of InCore Semiconductors, a company that develops processor technology for chip designers, said this kind of local intelligence is spreading across products ranging from cars and cameras to televisions and industrial equipment.
Atomo 的 Parmar 表示,此类芯片可在互联网连接中断时继续工作,将敏感数据保留在本地,并降低云端成本。
Such chips can continue working when internet connectivity fails, keep sensitive data on-site and reduce cloud costs, Atomo’s Parmar said.
他表示,对于工厂安全摄像头而言,不可靠的互联网可能延误关键警报,而本地处理图像可使其无论连接状况如何都能持续运行。
For a factory safety camera, unreliable internet could delay critical alerts, while processing images locally allows it to keep working regardless of connectivity, he said.
他补充道,印度对成本敏感的市场和不稳定的互联网连接使这些优势显得尤为重要。
India's cost-sensitive market and varying internet connectivity make those benefits particularly relevant, he added.
Atomo 还将电路板送往包括日本、韩国和中东在内的市场进行测试,Parmar 表示,在这些市场,响应时间、保密性和不间断运行同样重要。
Atomo has also sent circuit boards for testing in markets including Japan, South Korea and the Middle East, where Parmar said response time, confidentiality and uninterrupted operation are equally important.
根据市场研究公司 Grand View Research 的报告,2025 年全球消费电子设备占边缘 AI 芯片市场的 65.3%,这得益于智能手机、笔记本电脑和智能音箱中应用的不断增长。
Globally, consumer devices accounted for 65.3 per cent of the edge AI chip market in 2025, driven by growing use in smartphones, laptops and smart speakers, according to a report by market research firm Grand View Research.
报告称,印度市场预计将增长近 12 倍,从 2026 年的 9.841 亿美元增至 2033 年的 117 亿美元。
India’s market is projected to grow nearly 12 times, from US$984.1 million in 2026 to US$11.7 billion by 2033, the report said.
业内专家表示,机遇的规模是印度芯片设计师瞄准该市场的原因之一。印度成为边缘人工智能的试验场初创企业BigEndian Semiconductors的创始人孙尼尔·库马尔(Sunil Kumar)正在开发一款用于监控摄像头的AI处理器。他表示,专用芯片可以根据不同市场的需求进行定制。
The size of that opportunity is one reason Indian chip designers are targeting the market, industry experts said. INDIA AS A TESTING GROUND FOR EDGE AI Sunil Kumar, whose startup BigEndian Semiconductors is developing an AI-enabled processor for surveillance cameras, said specialised chips can be tailored to individual markets.
库马尔指出,例如铁路摄像头、工业摄像头或车载摄像头可能需要不同的硬件和软件,这使得小型企业拥有更大的定制空间,而无需主要依靠原始算力进行竞争。
A railway camera, industrial camera or vehicle, for example, can require different hardware and software, giving smaller companies more room to customise rather than compete primarily on raw computing power, Kumar said.
据印度投资促进局(Invest India)首席执行官、前英特尔印度公司负责人尼夫鲁蒂·赖(Nivruti Rai)称,印度拥有庞大的芯片设计人才队伍,全球约20%的半导体设计工程师位于该国。
India also has a large chip-design workforce, with about 20 per cent of the world's semiconductor design engineers based in the country, according to Invest India CEO and former Intel India head Nivruti Rai.
库马尔表示,印度的规模和复杂性使其可能成为此类技术的试验场。他以2025年持续45天、吸引超过6.6亿人的印度教朝圣活动“大壶节”(Kumbh Mela)的人群管理为例加以说明。
Kumar said India’s scale and complexity could make it a testing ground for such technology, pointing to crowd management at the Kumbh Mela, a Hindu pilgrimage that drew more than 660 million people over 45 days in 2025.
他说:“如果我能适应像……大壶节这样的地方,那么在芬兰解决同样的人群控制问题就会容易得多。”
“If I'm able to adapt to some place like … Kumbh Mela, solving the same crowd control issue in Finland is much easier,” he said.
投资者正在向该领域投入更多资金。根据数据洞察公司Tracxn的数据,2026年印度边缘AI芯片初创企业融资1700万美元,几乎是2022年427万美元的近四倍,而2020年之前这一数字几乎为零。
Investors are putting more money into the sector. Indian edge AI chip startups raised US$17 million in 2026, nearly four times the US$4.27 million raised in 2022, and up from virtually nothing before 2020, according to data insights firm Tracxn.
然而,更大的挑战在于说服那些已经使用成熟外国处理器的公司转向印度芯片。在该领域创业的创业者们向新加坡亚洲新闻台(CNA)表示。安全顾虑为本土芯片制造商带来机遇芯片初创企业Mindgrove Technologies的联合创始人沙什瓦思·拉姆库马尔(Shashwath Ramkumar)表示,他的公司会寻找客户“无论如何都想改变”的时机,因为法规、技术或产品要求已经发生变化。
The bigger challenge, however, is to persuade a company already using established foreign processors to switch to Indian chips, entrepreneurs building in the space told CNA. SECURITY CONCERNS GIVE LOCAL CHIPMAKERS A CHANCE Shashwath Ramkumar, co-founder of chip startup Mindgrove Technologies, said his company looks for moments when customers “want to change anyway” because regulations, technology or product requirements have shifted.
Mindgrove目前正与印度监控设备制造商Prama合作,为其安全摄像头开发视觉芯片。
Mindgrove is currently working with Indian surveillance manufacturer Prama to develop its vision chip for security cameras.
印度针对联网闭路电视系统的最新网络安全规定于4月1日生效。专家表示,新规对部分供应商产生影响,也为印度本土芯片企业创造了机遇。
India’s new cybersecurity rules for internet-connected CCTV systems, which took effect on Apr 1, have created opportunities for local chip firms as tighter rules affect some suppliers, experts said.
行业专家补充称,尽管印度尚未全面禁止中国监控摄像头,但更严格的安全和采购规定限制了从这一邻国进口部分监控设备。
While India has not banned Chinese CCTV cameras outright, tighter security and sourcing rules have restricted the import of some surveillance equipment from the neighbouring country, industry experts added.
市场研究机构Counterpoint Research的数据显示,2024年中国厂商约占印度闭路电视市场的三分之一。类似的压力也正在其他行业显现。
Chinese vendors accounted for about a third of India’s CCTV market in 2024, according to market research firm Counterpoint Research. Similar pressures are appearing in other industries.
Tracxn联合创始人Neha Singh表示,地缘政治问题以及供应链多元化努力,正促使印度一些汽车、工业和国防制造商更愿意评估本土设计的芯片。
Tracxn co-founder Neha Singh said geopolitical issues along with efforts to diversify supply chains are making some Indian automotive, industrial and defence manufacturers more willing to evaluate locally designed chips.
从样品到规模化 尽管市场机会增多,但 experts? The text says experts told CNA. Translate "印度芯片制造商仍面临将机会转化为实际订单的挑战,CNA援引 Experts". Need no English. "专家告诉CNA". Good.印度芯片制造商仍面临将市场机会转化为实际订单的挑战。专家在接受CNA采访时表示。
印度边缘人工智能芯片公司的创始人预计,未来一年将是关键时期。
FROM SAMPLES TO SCALE Despite the market opportunities, turning them into actual orders remains a challenge for Indian chipmakers, experts told CNA. The founders of Indian edge AI chip firms expect the coming year to be crucial. Ramkumar said Mindgrove's work with Prama could take roughly another year to produce a commercial product.
Ramkumar表示,Mindgrove与Prama的合作可能还需要大约一年才能推出商业化产品。
BigEndian is preparing to put its first AI-camera chip into customers' hands by the end of this year.
BigEndian正准备在年底前将其首款人工智能摄像头芯片交付给客户。
Kumar表示,制造商可能会与芯片设计公司讨论需求,但在拿到经过其产品测试的实物芯片之前,不太可能下单。
Kumar said manufacturers may discuss their needs with chip designers, but are unlikely to place orders until they have a physical chip that has been tested in their products.
Kumar将2026年称为“送样之年”,并表示芯片应用有望在2027年下半年真正形成规模。
Kumar described 2026 as the “year of sampling”, with a meaningful scale potentially emerging in the second half of 2027.
Ramkumar表示:“封装、测试和物流比设计更困难。”他补充说,当前的挑战是建立一套能够可靠实现芯片规模化交付的供应链。
Ramkumar said: “The packaging, testing and logistics are harder than design.”The challenge is building a supply chain that can reliably deliver chips at scale, he added.
Ramkumar表示,印度的芯片封装能力正开始扩张,这缓解了供应链挑战的一部分难题。
Ramkumar said India's chip-packaging capacity is beginning to expand, easing one part of the supply-chain challenge.
例如,由印度CG电力、日本瑞萨电子和泰国星微电子共同成立的合资企业CG Semi,已于七月在古吉拉特邦萨南德的芯片封装与测试工厂启动商业化生产。该工厂每年可封装和测试多达三亿颗芯片。
For instance, CG Semi, a joint venture between India's CG Power, Japan's Renesas Electronics and Thailand's Stars Microelectronics, began commercial production at its chip-packaging and testing facility in Sanand, Gujarat, in July. The facility can package and test up to 300 million chips a year.
在政府的半导体计划下,先进芯片封装是优先事项,政府将为新的组装、封装和测试设施提供财政支持。
Under the government’s semiconductor mission, advanced chip packaging is a priority, with financial support offered for new assembly, packaging and testing facilities.
Tracxn的辛格表示:“真正的考验在于,印度初创企业能否使其芯片易于制造商采用,在高产量下保持可靠性,并在印度以外具备竞争力——将客户的试用转化为国内的重复订单,并最终赢得大型全球客户。”
“The real test is whether Indian startups can make their chips easy for manufacturers to adopt, reliable at high volumes and competitive beyond India - turning customer trials into repeat orders at home and eventually winning large global customers,” said Tracxn's Singh.