阿姆斯特丹，10月16日：计算机芯片封装设备制造商Besi（BE Semiconductor Industries）股价周五下跌3%。此前，有影响力的半导体研究机构SemiAnalysis报道称，该公司的一款主要增长产品将面临更大竞争对手ASML的竞争。
AMSTERDAM, Oct 16 : Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3 per cent on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML.
SemiAnalysis的报告分析了ASML提交的27项专利申请，称这表明ASML正在开发一种混合键合产品。
The SemiAnalysis report analysed 27 patent filings by ASML, which it said indicated ASML was developing a hybrid bonding product.
Besi的规模仅为ASML的一小部分，ASML是制造半导体设备的最大制造商，但Besi是混合键合领域的领导者，混合键合是一种先进封装技术，正被用于制造新一代更强大的三维芯片。ASML尚未确认正在开发此类工具。Besi未回应置评请求。
Besi is a fraction of the size of ASML, the biggest maker of equipment used to make semiconductors, but Besi is a leader in hybrid bonding, an advanced packaging technology being used to create a new generation of more powerful three-dimensional chips. ASML has not confirmed it is developing such a tool. Besi did not respond to requests for comment.
阿姆斯特丹盘中交易时段，Besi股价下跌3%，报158.50欧元，而ASML上涨1.1%，报1480欧元。
Besi shares were down 3 per cent at €158.50, while ASML was up 1.1 per cent at €1,480 in midday Amsterdam trading.
ASML一位发言人拒绝就SemiAnalysis的报告发表评论，但指出该公司去年推出了其首款先进封装工具。该公司当时在一份声明中表示：“我们继续关注3D集成行业将向哪些方向发展……以及ASML的专业知识在哪些方面可以提供额外价值。”
A spokesperson for ASML declined to comment on the SemiAnalysis report but pointed to the company's launch of its first advanced packaging tool last year. "We continue to look at which directions the 3D integration industry will evolve ... and where ASML's expertise can be of additional value," the company said in a statement at that time.
3月，路透社援引首席技术官马可·皮特尔斯（Marco Pieters）的一则采访报道称，ASML计划推出更多封装工具。
In March, Reuters reported that ASML was planning additional packaging tools, citing Chief Technical Officer Marco Pieters in an interview.
Chip Stock Investor联合创始人尼克·罗索利洛（Nick Rossolillo）表示：“半导体市场已经表明，封装是可以释放性能提升的下一个前沿领域之一，而ASML似乎正在构建朝着同一方向发展的下一代工具。”
"The semiconductor market has already signalled that packaging is one of those next frontiers where performance gains can be unlocked, and ASML seems to be building next-gen tools headed in the same direction," said Nick Rossolillo, co-founder of Chip Stock Investor.
“我们认为，超越EUV产线的新一批封装工具，对于实现支撑ASML高估值所需的增长至关重要。”
"We see the new batch of packaging tools, beyond an EUV pipeline, as critical to pulling off the growth needed to justify (ASML's) elevated valuation."