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黑石2023年向CoreWeave发放贷款 为芯片抵押债务市场确立范本黑石2023年向CoreWeave发放贷款 为芯片抵押债务市场确立范本

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2023年,黑石集团旗下战略机会部门牵头向AI云服务提供商CoreWeave公司发放了一笔23亿美元的私募信贷贷款,用于为其采购半导体硬件提供资金支持。

Blackstone's 2023 CoreWeave Loan Established Blueprint for Chip-Backed Debt Market In 2023, Blackstone Inc.'s tactical opportunities group led a $2.3 billion private credit loan to AI cloud provider CoreWeave Inc. to finance semiconductor hardware acquisitions.

尽管黑石高层最初对图形处理单元(GPU)以及人工智能行业的持久性存有疑虑,但公司最终批准了这笔融资。

Despite initial questions from Blackstone leadership regarding graphics processing units and the durability of the artificial intelligence sector, the firm approved the financing.

这笔交易成为芯片抵押债务的结构性范本,帮助开启了一个专注于AI算力基础设施的资产支持借贷领域。

The transaction became a structural model for chip-collateralized debt, helping initiate an asset-backed borrowing sector focused on AI computing infrastructure.

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