韩国主要存储芯片供应商SK海力士在其业绩发布演示文稿和周三的业绩电话会上表示，其DRAM和高带宽存储器（HBM）产量实际上已售罄至2029年。
SK Hynix Says DRAM and HBM Capacity Is Effectively Sold Out Through 2029 SK Hynix, a major South Korean memory-chip supplier, said in its earnings presentation and Wednesday earnings call that its DRAM and High Bandwidth Memory volumes are effectively sold out through 2029.
客户已通过长期协议锁定2027年和2028年超过50%的制造产能，包括全球云服务提供商在内的14家关键客户已签署此类协议。
Customers have secured more than 50% of manufacturing capacity for 2027 and 2028 through long-term agreements, and 14 key customers, including global cloud-service providers, have signed such agreements.
SK海力士预计内存需求将超过供应，持续至2030年，并称新建设施需要数年时间。
SK Hynix expects memory demand to exceed supply through 2030 and says new facilities will take years to build.
文章指出，供应紧张可能推高消费电子产品价格，减少PC和智能手机出货量，但因AI基础设施需求，整体市场增长将得到持续支撑。
The article states that tight supply may raise consumer-electronics prices, reduce PC and smartphone shipments, and support continued overall market growth because of AI infrastructure demand.