彭博社报道，三星电子计划将2026年资本支出提高逾60%至84.4万亿韩元（约合630亿美元）。
Samsung to lift 2026 chip spending to $63 billion as HBM capacity sells out, but shares fall after earnings miss and payout delay Bloomberg reports that Samsung Electronics plans to raise 2026 capital expenditure by more than 60% to 84.4 trillion won, or about $63 billion.
据报道，该公司高端HBM芯片2027年的产能已售罄，并正寻求从SK海力士和美光科技手中夺取市场份额。
The company has reportedly sold out of high-end HBM chips for 2027 and is seeking market share from SK Hynix and Micron.
然而，三星芯片部门的营业利润较预期低约2%，且公司将未来股东回报的细节推迟至1月公布。消息公布后，三星股价在首尔下跌约5%。
However, Samsung’s chip-division operating income fell about 2% short of estimates, and the company deferred details on future shareholder payouts until January. Samsung’s shares fell about 5% in Seoul after the update.
该报道发布于2026年10月28日，描述了半导体投资扩大与投资者失望并存的局面。
The report was published on October 28, 2026, and describes expanded semiconductor investment alongside investor disappointment.