博世将于2028年1月起将其半导体业务划入专门部门，因该德国供应商希望将芯片销售扩展至汽车行业之外。
Bosch will move its semiconductor business into a dedicated division from January 2028, as the German supplier looks to expand chip sales beyond the automotive industry.
公司今日宣布，目标到2030年实现约50亿欧元的年度半导体收入。新部门将被命名为Semiconductors，仍属于博世，而非独立公司。
The company is targeting annual semiconductor revenue of around €5bn by 2030, it announced today. The new unit, which will be called Semiconductors, will remain part of Bosch rather than becoming a separate company.
目前其芯片业务隶属于移动电子部，该部仍将继续负责车辆电子控制单元的生产。此次重组反映了博世在汽车领域之外寻找更多芯片客户的雄心。
Its chip business currently sits within the Mobility Electronics division, which will continue to handle the production of electronic control units for vehicles. The restructuring reflects Bosch’s ambition to find more customers for its chips outside the automotive sector.
公司计划向外部客户开放其制造设施，并扩大代工业务，为其他公司生产半导体。
The company plans to open its manufacturing facilities to external clients and expand its foundry business, producing semiconductors for other companies.
其目标市场包括机器人、工厂自动化和人工智能数据中心，以及手机和可穿戴设备等消费类产品。博世表示，其元件已在控制类人机器人中发挥作用。
Its target markets include robotics, factory automation and AI data centres, alongside consumer devices such as phones and wearables. Bosch says its components already play a role in controlling humanoid robots.
“通过成立专门部门，我们在超过60年的半导体历史中开启了新篇章，”博世芯片业务负责人埃里克·赖因说。
“With the founding of a dedicated unit, we are opening a new chapter in our more than 60-year semiconductor history,” said Erik Rein, who heads Bosch’s chip business.
博世在专业半导体市场拥有多项成熟布局。它是MEMS传感器的领先供应商，MEMS传感器是用于智能手机和机器人等设备的微型运动和压力传感器。公司还生产碳化硅芯片和电力系统的定制电路。
Bosch has several established positions in specialised semiconductor markets. It is a leading supplier of MEMS sensors, the miniature motion and pressure sensors used in devices such as smartphones and robots. The company also produces silicon carbide chips and custom circuits for power systems.
其制造网络覆盖全球约40个芯片工厂。博世已在德累斯顿和雷特林根的晶圆厂投入约30亿欧元，并在加利福尼亚州罗斯维尔的设施投入约20亿美元转型为碳化硅生产。
Its manufacturing footprint spans around 40 chip sites worldwide. Bosch has invested approximately €3bn in its wafer plants in Dresden and Reutlingen, and is spending around $2bn to convert its Roseville, California facility to silicon carbide production.
公司还计划在马来西亚槟城扩建测试中心，直至2030年代中期。它持有TSMC主导的半导体合资企业ESMC 10%的股权，该企业正在德累斯顿建设工厂。
The company also plans to expand its test centre in Penang, Malaysia, through the mid-2030s. It holds a 10% stake in ESMC, the TSMC-led semiconductor joint venture building a factory in Dresden.
这一步骤是在欧洲汽车行业仍在应对芯片供应风险的背景下作出的。
The move comes as Europe’s automotive industry continues to grapple with chip supply risks.
汽车制造商在秋季期间曾花费一段时间来应对 Nexperia 争端所导致的短缺，这一事件暴露了行业对少数供应商的依赖。
Carmakers spent part of the autumn managing shortages during the Nexperia dispute, which exposed the industry’s dependence on a limited number of suppliers.
通过向外部客户提供制造产能，博世能够帮助欧洲多元化芯片供应，并为自身技术寻找新市场。
By offering manufacturing capacity to outside customers, Bosch could help diversify Europe’s chip supply while seeking new markets for its own technology.
博世副董事长马库斯·海因表示，公司传感器是其产品的“关键”，也是客户创新的“技术基础”。
Bosch deputy chairman Markus Heyn said the company’s sensors are “the key” to its products and “the technological basis” for its customers’ innovations.