10月22日：必益昂半导体工业公司周四公布的第三季度订单超出市场预期，得益于人工智能数据中心的强劲需求，并驳斥了分析师关于阿斯麦可能在混合键合领域构成挑战的报告。
Oct 22 : BE Semiconductor Industries on Thursday beat market expectations for third-quarter orders on strong AI data-centre demand and dismissed analyst reports that ASML could challenge it in hybrid bonding.
订单摄入量是行业最密切关注的指标，为3.426亿欧元（3.852亿美元），较第二季度增长17%，较去年同期增长96%。研究机构Visible Alpha调查的分析师此前预期为2.98亿欧元。
Order intake, the industry's most closely watched metric, was €342.6 million ($385.2 million), rising 17 per cent from the second quarter and 96 per cent from a year ago. Analysts polled by researcher Visible Alpha had expected €298 million.
该公司还表示，将于10月27日启动一项新的1亿欧元股票回购计划。
The company also said it would launch a new €100 million share buyback on October 27.
首席执行官称阿斯麦不被视为混合键合竞争对手 必益昂正押注混合键合技术，该技术将堆叠芯片直接连接，实现更快、更节能的互联。公司称，今年该类系统的订单已较2025年全年翻了一倍多。
ASML NOT SEEN AS HYBRID BONDING RIVAL, CEO SAYS Besi is betting on hybrid bonding, a technology that joins stacked chips directly for faster, more energy-efficient connections. Orders for those systems have more than doubled this year compared with all of 2025, it said.
“我们不认为阿斯麦是混合键合领域的竞争对手，”首席执行官Richard Blickman在声明中表示，并补充说，这两家荷兰公司正在合作，提高必益昂设备芯片放置的精度。
"We do not view ASML as a hybrid bonding competitor," CEO Richard Blickman said in the statement, adding that the two Dutch companies were working together to improve how precisely Besi's machines place chips.
上周，研究机构SemiAnalysis称芯片制造设备商阿斯麦似乎正在开发竞争性的混合键合工具，导致必益昂股价下跌。阿斯麦尚未证实此事。
Besi's shares took a dip last week after research firm SemiAnalysis said that chipmaking equipment maker ASML appeared to be developing a rival hybrid bonding tool. ASML has not confirmed this.
Blickman表示，就他所知，阿斯麦感兴趣的是“未来十年芯片内部的3D晶体管堆叠，而非与必益昂竞争”。
Blickman said that, to the best of his knowledge, ASML was interested in "3D transistor stacking inside the chip over the next decade and not in competing with Besi".
投资者还担心，美光或SK海力士等存储芯片制造商可能采用混合键合技术用于高带宽存储（AI加速器的关键组件）的速度较慢。自6月高点以来，必益昂股价已大致腰斩。
Investors have also worried that memory makers such as Micron or SK Hynix might be slow to adopt hybrid bonding for high-bandwidth memory, a key component in AI accelerators. Besi shares have roughly halved since a June peak.
第四季度展望偏软 必益昂预计第四季度收入将与第三季度的2.834亿欧元大体持平，上下浮动5%。伦敦证券交易所集团（LSEG）调查的分析师此前预期第三、四季度收入分别为2.773亿欧元和2.915亿欧元。
SOFTER Q4 OUTLOOK Besi expects fourth-quarter revenue to be broadly unchanged from the third quarter’s €283.4 million, give or take 5 per cent. Analysts polled by LSEG had expected third- and fourth-quarter revenue of €277.3 million and €291.5 million, respectively.
有客户要求将第三季度的订单交付时间与他们2027年上半年的生产计划相匹配。
It said some customers had asked for deliveries of third-quarter orders to be timed with their production plans for the first half of 2027.
ING银行的分析师马克·赫塞尔林克（Marc Hesselink）表示，强劲的订单需求、混合键合技术的持续发展、ASML公司的澄清声明以及公司实施的股票回购计划，足以弥补公司业绩指引中的不足；“尤其是考虑到这种业绩差距与时间安排密切相关”。
ING analyst Marc Hesselink said that stronger orders, hybrid bonding momentum, the ASML clarification and the buyback more than offset the softer guidance, “particularly given the timing-related nature of the shortfall”.